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Participation in International Conference 3DIC 2024 (Academic Presentation & Booth Exhibition)
(IEEE International 3D Systems Integration Conference 2024)
- Date
- September 25-27, 2024 (Wed-Fri)
- Venue
- September 25, 2024 at Hotel Metropolitan Sendai
September 26-27, 2024 at Sendai Kokusai Hotel
- Official Website
- https://3dic-conf.org/
Our Schedule
■ Session Presentation
- Title
- "A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy Peeling and Excellent TTV for 3DIC"
- Presentation Date & Time
- September 26, 10:45 AM - 11:05 AM
※3DIC_Program_Schedule : For more details
- Exhibition Period
- September 26, 2024 - September 27, 2024
- Venue
- Sendai Kokusai Hotel
- Booth Number
- #12
2024.09.02
过往信息
2023.11.17
最优秀论文受奖: 积水化学开発品「高耐热假贴UV易解离胶带-耐热SELFA™」
- 得奖作者
- 冈村和泉、渡边良一、高桥骏夫及其他4位开发人员。
（隶属于积水化学高机能Plastic Company开発研究所）
2023.11.02
2023年12月13日-15日 (五)10:00-17:00 于 东京Big Sight国际展示中心 (东展览馆)
2023.08.28
- Duration
- Sep. 6 (Wed) – Sep. 8 (Fri), 2023
2023.08.02
EMC/China 第20届电磁兼容暨微波天线展览会 &
EDWTech 高速通信与电子设计会
- 会期
- 2023年8月9日（周三）-8月11日（周五）
- 地点
- 上海世博展览馆
积水化学展区 : 3館2楼1147号
2023.05.26
2023年IEEE第73届电子元器件与技术会议(ECTC2023) 出展
- 会期
- 2023年5月30日（周二）-6月2日（周五）
- 地点
- 格兰德湖奥兰多 JW 万豪酒店
（美国佛罗里达州奥兰多）
2022.12.26
Best Paper Award of IMPACT 2022 !!
At the largest international PCB and packaging conference in Taiwan, Best Paper Award was given for our newly developed SELFA™series product for hybrid bonding process that enables many thermal processes to fabricate high performance semiconductor packages (Super High Thermal Resistance SELFA™)
Author: Izumi Daido, Ryoichi Watanabe, Toshio Takahashi
2022.11.07
积水化学出展「先进封装及小晶片高峰会」Advanced Packaging and Chiplet Summit
东京国际展示中心 (东展览馆 1-3) 2022年12月14日-16日 (五)10:00-17:00
2022.10.07
We will make a presentation at IMPACT2022
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity
2021.06.01
参加并在ECTC上针对以下两项研究进行了演讲 ECTC (2021 IEEE 71st Electronic Components and Technology Conference)
①Title:Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding
②Development of Highly Reliable Crack Resistive Build-up Dielectric Material with Low Df Characteristic for Next-Gen 2.5D Packages