TOPICS List

3DIC 2024

Participation in International Conference 3DIC 2024 (Academic Presentation & Booth Exhibition)
(IEEE International 3D Systems Integration Conference 2024)

Date
September 25-27, 2024 (Wed-Fri)
Venue
September 25, 2024 at Hotel Metropolitan Sendai
September 26-27, 2024 at Sendai Kokusai Hotel
Official Website
https://3dic-conf.org/

Our Schedule
■ Session Presentation

Title
"A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy Peeling and Excellent TTV for 3DIC"
Presentation Date & Time
September 26, 10:45 AM - 11:05 AM

※3DIC_Program_Schedule : For more details

■ Booth Exhibition
Exhibition Period
September 26, 2024 - September 27, 2024
Venue
Sendai Kokusai Hotel
Booth Number
#12

2024.09.02

过往信息

2023.11.17

最优秀论文受奖: 积水化学开発品「高耐热假贴UV易解离胶带-耐热SELFA™」

论文名:
A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity

得奖作者
冈村和泉、渡边良一、高桥骏夫及其他4位开发人员。
(隶属于积水化学高机能Plastic Company开発研究所)

2023.11.02

SEMICON JAPAN

2023年12月13日-15日 (五)10:00-17:00 于 东京Big Sight国际展示中心 (东展览馆)

2023.08.28

SEMICON TAIWAN 2023

Duration
Sep. 6 (Wed) – Sep. 8 (Fri), 2023

2023.08.02

EMC/China 第20届电磁兼容暨微波天线展览会 &
EDWTech 高速通信与电子设计会

会期
2023年8月9日(周三)-8月11日(周五)
地点
上海世博展览馆
积水化学展区 : 3館2楼1147号

2023.05.26

2023年IEEE第73届电子元器件与技术会议(ECTC2023) 出展

会期
2023年5月30日(周二)-6月2日(周五)
地点
格兰德湖奥兰多 JW 万豪酒店
(美国佛罗里达州奥兰多)

2022.12.26

Best Paper Award of IMPACT 2022 !!

At the largest international PCB and packaging conference in Taiwan, Best Paper Award was given for our newly developed SELFA™series product for hybrid bonding process that enables many thermal processes to fabricate high performance semiconductor packages (Super High Thermal Resistance SELFA™)

Author: Izumi Daido, Ryoichi Watanabe, Toshio Takahashi

2022.11.07

积水化学出展「先进封装及小晶片高峰会」Advanced Packaging and Chiplet Summit

东京国际展示中心 (东展览馆 1-3) 2022年12月14日-16日 (五)10:00-17:00

2022.10.07

We will make a presentation at IMPACT2022

A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity

2021.06.01

参加并在ECTC上针对以下两项研究进行了演讲 ECTC (2021 IEEE 71st Electronic Components and Technology Conference)

①Title:Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding
②Development of Highly Reliable Crack Resistive Build-up Dielectric Material with Low Df Characteristic for Next-Gen 2.5D Packages