TOPICS List

SEMICON TAIWAN 2023

Exhibit Information

SEMICON TAIWAN 2023

Duration
Sep. 6 (Wed) – Sep. 8 (Fri), 2023
Venue
Taipei Nangang Exhibition Center Halls 1 & 2
Our Exhibition Booth : 4th Floor Hall 1
For more information, click here.

Main Products to be Exhibited:
1.Heat-curing resin for SAC solder connection <EPOXY FLUX>
2.Transport container <Clean Container series>
3.Super Thermal-Conductive Pads <MANION Series>
4.High Adhesion-easy Removable UV Tape <SELFA series>
5.For FC-BGA substrates <SEKISUI Build up Film>

Aug.28, 2023

EDW Tech / EMC 2023

展览信息

EMC/China 第20届电磁兼容暨微波天线展览会&
EDWTech 高速通信与电子设计会

会期
2023年8月9日(周三)-8月11日(周五)
地点
上海世博展览馆
积水化学展区 : 3館2楼1147号

主要参展产品
1.透明柔性电波反射膜 2.超导导热垫片 3.压缩型导电连接器 4.吸音材

2023.08.02

The 2023 IEEE 73rd(ECTC) 出展

2023年IEEE第73届电子元器件与技术会议(ECTC2023) 出展

会期
2023年5月30日(周二)-6月2日(周五)
地点
格兰德湖奥兰多 JW 万豪酒店
(美国佛罗里达州奥兰多)
Sekisui Chemical Exhibit Area #236

参展产品:
1.Build Up Film2.高黏着力易解离UV胶带SELFA系列
3.散热材料4.高解析度3D Printer(Inkjet)材料

展览会网址:https://www.ectc.net/program/73-ECTCFinal-Web.pdf

2023.05.26

过往信息

2022.12.26

Best Paper Award of IMPACT 2022 !!

At the largest international PCB and packaging conference in Taiwan, Best Paper Award was given for our newly developed SELFA series product for hybrid bonding process that enables many thermal processes to fabricate high performance semiconductor packages (Super High Thermal Resistance SELFA)

Author: Izumi Daido, Ryoichi Watanabe, Toshio Takahashi


2022.11.07

积水化学出展「先进封装及小晶片高峰会」Advanced Packaging and Chiplet Summit

东京国际展示中心 (东展览馆 1-3) 2022年12月14日-16日 (五)10:00-17:00

2022.10.07

We will make a presentation at IMPACT2022

A Laser Release Temporary Bonding Tape for Hybrid Bonding Having High Thermal Resistance and Excellent Thickness Uniformity

2021.06.01

参加并在ECTC上针对以下两项研究进行了演讲 ECTC (2021 IEEE 71st Electronic Components and Technology Conference)

①Title:Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding
②Development of Highly Reliable Crack Resistive Build-up Dielectric Material with Low Df Characteristic for Next-Gen 2.5D Packages