

半导体相关材料
SEMICONDUCTOR
积水化学为半导体晶圆制造及封装制程工艺提供
胶带、薄膜、树脂、微粒子等产品。


次世代显示器相关材料
NEXT-GENERATION DISPLAY
积水化学提供用于OLED和μLED等显示器的密封材料和减震材料。


AR/VR相关材料
AR / VR
积水化学提供AR/VR等可穿戴装置所需要的粘着、减震、
防水、散热、异方性导电等产品。
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次世代显示器
不论是高画质或是高性能的次世代显示器,
积水化学的电子材料都能解决您开发上的问题。

Build Up Film
积水的绝缘增层膜被广泛使用在需求 低损耗低翘曲的IC封装基板中

环境友善产品
积水化学提供可节约资源和能源,
及减少对地球环境造成负担的各式各样机能化学品。
- 适用于氟树脂表面粘接的双面胶带
- 使用结合了自然功能的粘合剂进而实现对氟树脂的粘合
- 散热相关产品
- 积水化学的散热相关系列产品。
(散热胶/无硅散热导胶、散热片、金属底材基板)
- 行业术语
- 向您介绍电子行业的相关术语

高机能塑料事业领域开发研究所 前所长
(2019年退休)
Science Lab. Ishizue现任代表
中寿贺 章
高机能塑料事业领域
开发研究所
电子材料开发中心
主任技术员
高桥 俊夫
TOPICS

We will exhibit at Advanced Packaging and Chiplet Summit
Tokyo Big Sight (East Exhibition Hall)
Dec 11 to 13, 2024 (10:00 am–5:00 pm JST)
For top players in semiconductor packaging and PCB mounting
Join APCS to partake in advancing the semiconductor packaging technology and uncovering growth opportunities
Exhibit Products:
- High Adhesion-easy Removable UV Tape SELFA™
- Clean Container series
- High-viscosity inkjet ink
- EPOXY FLUX (Under development)
- Adhesive (PSA) Dot Connector
Sekisui Chemical Exhibit Area East Exhibition Hall 3452
We provide advanced high-performance materials that help solve social issues.
Please stop by our booth.
2024.11.12

Participation in International Conference 3DIC 2024 (Academic Presentation & Booth Exhibition)
(IEEE International 3D Systems Integration Conference 2024)
- Date
- September 25-27, 2024 (Wed-Fri)
- Venue
- September 25, 2024 at Hotel Metropolitan Sendai
September 26-27, 2024 at Sendai Kokusai Hotel
- Official Website
- https://3dic-conf.org/
Our Schedule
■ Session Presentation
- Title
- "A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy Peeling and Excellent TTV for 3DIC"
- Presentation Date & Time
- September 26, 10:45 AM - 11:05 AM
※3DIC_Program_Schedule : For more details
- Exhibition Period
- September 26, 2024 - September 27, 2024
- Venue
- Sendai Kokusai Hotel
- Booth Number
- #12
2024.09.02