半导体相关材料
SEMICONDUCTOR

积水化学为半导体晶圆制造及封装制程工艺提供
胶带、薄膜、树脂、微粒子等产品。

次世代显示器相关材料
NEXT-GENERATION DISPLAY

积水化学提供用于OLED和μLED等显示器的密封材料和减震材料。

AR/VR相关材料
AR / VR

积水化学提供AR/VR等可穿戴装置所需要的粘着、减震、
防水、散热、异方性导电等产品。

产品的研发故事SEKISUIProduct Development Story

通过“粘接与剥离”的创新技术
持续支持半导体工艺发展的SELFA™

高机能塑料事业领域开发研究所 前所长
(2019年退休)
Science Lab. Ishizue现任代表

中寿贺 章

高机能塑料事业领域
开发研究所
电子材料开发中心
主任技术员

高桥 俊夫

TOPICS

We will exhibit at Advanced Packaging and Chiplet Summit

Tokyo Big Sight (East Exhibition Hall)
Dec 11 to 13, 2024 (10:00 am–5:00 pm JST)

For top players in semiconductor packaging and PCB mounting
Join APCS to partake in advancing the semiconductor packaging technology and uncovering growth opportunities

Exhibit Products:

Sekisui Chemical Exhibit Area East Exhibition Hall 3452

We provide advanced high-performance materials that help solve social issues.
Please stop by our booth.

2024.11.12

3DIC 2024

Participation in International Conference 3DIC 2024 (Academic Presentation & Booth Exhibition)
(IEEE International 3D Systems Integration Conference 2024)

Date
September 25-27, 2024 (Wed-Fri)
Venue
September 25, 2024 at Hotel Metropolitan Sendai
September 26-27, 2024 at Sendai Kokusai Hotel
Official Website
https://3dic-conf.org/

Our Schedule
■ Session Presentation

Title
"A Temporary Bonding De-Bonding Tape with High Thermal Resistance, Easy Peeling and Excellent TTV for 3DIC"
Presentation Date & Time
September 26, 10:45 AM - 11:05 AM

※3DIC_Program_Schedule : For more details

■ Booth Exhibition
Exhibition Period
September 26, 2024 - September 27, 2024
Venue
Sendai Kokusai Hotel
Booth Number
#12

2024.09.02

モビリティ戦略室